METHOD OF PREPARING AN ELECTRONIC PACKAGE BY CO-CURING ADHESIVE AND ENCAPSULANT

摘要

A SEMI-CONDUCTOR PACKAGE IN WHICH AN INTEGRATED CIRCUIT CHIP IS CONNECTED TO A SUBSTRATE USING WIRE-BONDING IS PREPARED BY CURING THE DIE ATTACH ADHESIVE AND ENCAPSULATING THE WIRE BONDS IN ONE HEATING STEP. THE ENCAPSULANT COMPOSTION HAS A CURING CHEMISTRY AND A PROFILE COMPATIBLE WITH THOSE OF THE ADHESIVE.