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SOLDER FOR USE ON SURFACES COATED WITH NICKEL BY ELECTROLESS PLATING
SOLDER FOR USE ON SURFACES COATED WITH NICKEL BY ELECTROLESS PLATING
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机译:用于通过化学镀镍镀镍表面的焊料
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摘要
PROBLEM TO BE SOLVED: To solve the problem that, though soldering has heretofore been performed with a solder alloy having a composition in the vicinity of an Sn-Pb eutectic in a BGA (Ball Grid Array) substrate and a printed circuit board coated with electroless Ni plating, if electric appliances incorporated with these substrates or the like are subjected to strong impact, the soldered parts are easily peeled.;SOLUTION: The solder alloy has resistance to peeling when a soldering part subjected to electroless Ni plating is soldered, and is composed by adding, by mass, 0.002 to 0.01% P and 0.04 to 0.3% Cu to a solder alloy having a composition in the vicinity of an Sn-Pb eutectic comprising 60 to 64% Sn, and the balance Pb.;COPYRIGHT: (C)2004,JPO
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