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NON-REDUCINLE DIELECTRIC CERAMIC COMPOSITION, MULTILAYER CERAMIC CHIP CAPACITOR USING THE COMPOSITION AND METHOD FOR PREPARING THE MULTILAYER CERAMIC CHIP CAPACITOR
NON-REDUCINLE DIELECTRIC CERAMIC COMPOSITION, MULTILAYER CERAMIC CHIP CAPACITOR USING THE COMPOSITION AND METHOD FOR PREPARING THE MULTILAYER CERAMIC CHIP CAPACITOR
The present invention relates to a reducing dielectric ceramic composition and a multilayer ceramic capacitor and a manufacturing method using the same. The dielectric ceramic composition (Sr 1-x Ca x) (Zr 1-yz Ti y Mn z) as the principal component of the O 3 (however, 0≤x≤1.00, 0.15≤y≤0.5, 0.005≤z≤0.05), It comprises a sub-component of the glass composition. The glass composition aM1O 2-bSiO -cM2 2 O 3 (where M1 is Ca, Ba, Sr, Mg, selected from one or two paper sangyigo Zn, M2 is one or more selected from B, Al) expressed in and, as the a + b + c = 1, 0.1≤a≤0.75, 0.2≤b≤0.6, 0≤c≤0.5 as, in the content of the dielectric ceramic composition comprises 2.0 ~ 6.0 wt%. The present invention also provides a dielectric ceramic composition of multilayer ceramic capacitor and a manufacturing method using a. A multilayer ceramic capacitor of the present invention is used for the temperature compensation to satisfy a dielectric constant of 60 and a rate of temperature change is more than the capacitance 470 ± 60ppm / ℃ or 750 ± 120ppm / ℃. ; Reducing resistance, capacitor, Mn oxide, the glass composition
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机译:还原性介电陶瓷组合物和多层陶瓷电容器及其制造方法技术领域本发明涉及还原性介电陶瓷组合物和多层陶瓷电容器及其制造方法。介电陶瓷成分(Sr 1-x Sub> Sub> Ca x) Sub>(Zr 1-yz Sub> Ti y Sub> Mn z) Sub>作为O 3 Sub>的主要成分(但0≤x≤1.00、0.15≤y≤0.5、0.005≤z≤0.05) ,其包含玻璃组合物的子组分。玻璃成分aM1O 2-bSiO Sub> -cM2 2 Sub> O 3 Sub>(其中M1为Ca,Ba,Sr,Mg,选自一种或两种纸sangyigo Zn,M2是选自下式中的一种或多种:a和b + c = 1,其中a≤0.1≤a≤0.75、0.2≤b≤0.6、0≤c≤0.5介电陶瓷组合物的含量为2.0〜6.0重量%。本发明还提供了多层陶瓷电容器的介电陶瓷组合物及其制造方法。本发明的多层陶瓷电容器用于温度补偿以满足介电常数60,并且温度变化率大于电容470±60ppm /℃或750±120ppm /℃。 ;还原电阻,电容器,氧化锰,玻璃组成
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