Samsung copper laminate structure for flexible circuit board with a tie -component compound layer

摘要

The invention of the flexible circuit board for a multilayer structure is V Zn- trace amount of a base film or a Zn- to form a tie layer consisting of a copper compound containing Ta. ; in this case, the tie layer consisting of a copper compound containing Zn-V is a good component that is higher than the ratio of Zn component ratio of V, preferably the component percentage of Zn is less than 2.5 % and 5% , it is preferable content ratio of V is less than 2.5% . ; In addition, the tie layer consisting of a copper -containing compound which is a Zn-Ta recommend content ratio of the Zn is higher than the content ratio of Ta, preferably the component percentage of Zn is more than 2.5% and 5 % or less , it is preferable component ratio of Ta is less than 2.5% . ; copper compound , tie layer