首页> 外国专利> COMPOSITE STRUCTURE OF TRANSPARENT CONDUCTING FILM USING DIAMOND-LIKE CARBON FILM AS BUFFER LAYER

COMPOSITE STRUCTURE OF TRANSPARENT CONDUCTING FILM USING DIAMOND-LIKE CARBON FILM AS BUFFER LAYER

机译:以金刚石薄膜为缓冲层的透明导电膜的复合结构

摘要

PURPOSE: A composite transparent conducting film using a diamond-like carbon film as a buffer layer is provided to prolong a life of products such as a display element and a touch panel. CONSTITUTION: The composite transparent conducting film using a diamond-like carbon film as buffer layer comprises a transparent substrate(10); a buffer layer(20) of diamond-like carbon(DLC) formed on the transparent substrate; and a transparent conducting film formed on the buffer layer. The DLC buffer layer is formed by a plasma enhanced vapour deposition method. The DLC buffer layer has a structure of a-C:H(amorphous hydrogenated carbon).
机译:目的:提供一种使用类金刚石碳膜作为缓冲层的复合透明导电膜,以延长诸如显示元件和触摸面板等产品的寿命。组成:使用类金刚石碳膜作为缓冲层的复合透明导电膜,包括透明基板(10);在透明基板上形成类金刚石碳(DLC)的缓冲层(20)。透明导电膜形成在缓冲层上。 DLC缓冲层通过等离子体增强气相沉积法形成。 DLC缓冲层具有α-C:H(非晶氢化碳)的结构。

著录项

  • 公开/公告号KR100613657B1

    专利类型

  • 公开/公告日2006-08-21

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030031470

  • 发明设计人 정희섭;김명근;서용운;

    申请日2003-05-19

  • 分类号B32B9;

  • 国家 KR

  • 入库时间 2022-08-21 21:23:13

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号