Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted

摘要

The circuit board device has an inner circuit board (1) in which a screening hole (2) is provided which is surrounded by a metal sleeve (3) and filled with a filling material (7). A signal hole is arranged in the filling material within the screening hole and is through-contacted. An independent claim is included for a method of manufacturing a circuit board.