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Bath for the electroless deposition of palladium is based on an aqueous solution containing a divalent palladium compound, a base and a reducing agent

机译:用于化学沉积钯的镀液基于含有二价钯化合物,碱和还原剂的水溶液

摘要

Bath for the electroless deposition of palladium is based on an aqueous solution containing 0.01-0.5 mol/l divalent palladium compound, 0.04-2 mol/l base selected from ammonia, primary alkyl amines with up to five carbon atoms, ethanolamine, ethylene diamine and N-methylated ethylene diamine and 1-15 mol/l ammonium formate as reducing agent. An independent claim is also included for: a process for the electroless deposition of palladium using the above bath.
机译:化学沉积钯浴是基于一种水溶液,该水溶液包含0.01-0.5 mol / l二价钯化合物,0.04-2 mol / l碱,选自氨,具有最多五个碳原子的伯烷基胺,乙醇胺,乙二胺和N-甲基化乙二胺和1-15 mol / l甲酸铵作为还原剂。还包括以下独立权利要求:使用上述浴液进行化学镀钯的方法。

著录项

  • 公开/公告号DE102004046258A1

    专利类型

  • 公开/公告日2006-04-06

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20041046258

  • 发明设计人 UNGER EUGEN;

    申请日2004-09-23

  • 分类号C23C18/44;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:42

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