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Bath for the electroless deposition of palladium is based on an aqueous solution containing a divalent palladium compound, a base and a reducing agent
Bath for the electroless deposition of palladium is based on an aqueous solution containing a divalent palladium compound, a base and a reducing agent
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机译:用于化学沉积钯的镀液基于含有二价钯化合物,碱和还原剂的水溶液
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摘要
Bath for the electroless deposition of palladium is based on an aqueous solution containing 0.01-0.5 mol/l divalent palladium compound, 0.04-2 mol/l base selected from ammonia, primary alkyl amines with up to five carbon atoms, ethanolamine, ethylene diamine and N-methylated ethylene diamine and 1-15 mol/l ammonium formate as reducing agent. An independent claim is also included for: a process for the electroless deposition of palladium using the above bath.
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