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Field effect transistor, transistor arrangement, as well as a process for the preparation of a semiconducting silicon monocrystalline substrate and a transistor arrangement

机译:场效应晶体管,晶体管装置以及制备半导体单晶硅衬底的方法和晶体管装置

摘要

For the insulation of active regions of n - fets (91) and p - fets (92), in addition to the portions of a semiconductor substrate (1) designed active areas (11n, 11p) insulator structures (21n, 21p, 22n, 22p) in the semiconductor substrate (1) is provided, which as a consequence of the tensile stress or a compressive stress on the respectively adjacent active regions (11n, exert 11p), and this correspondingly bracing. The insulator structures (21n, 21p, 22n, 22p) are in each case based on a base portion (211), through which in adjacent active regions (21n), a tensile stress is induced. In each case to a p - fet (92) subsequent insulator structures (21p, 22p) are selectively with additional buffer layers (61), through which a compressive stress is induced in the adjacent structures. The charge carrier mobility, as well as of electrons in the channel regions (112n) of the n - fets (91) as well as the holes in the channel regions (112p) of the p - fets (92) is increased and the functionality of both of the n - fets (91) as well as of the p - fets (92) improved.
机译:为了隔离n-fet(91)和p-fets(92)的有源区域,除了半导体衬底(1)的部分外,还设计了有源区域(11n,11p)绝缘体结构(21n,21p,22n,在半导体衬底(1)中设置有如图22p)所示的区域,其由于分别相邻的有源区域(11n,施加11p)上的拉应力或压应力而相应地支撑。绝缘体结构(21n,21p,22n,22p)分别基于基部(211),通过基部在相邻的有源区域(21n)中引起张应力。在每种情况下,对于p-fet(92),后续的绝缘体结构(21p,22p)选择性地具有附加的缓冲层(61),通过该缓冲层在相邻的结构中引起压应力。 n-FET(91)的沟道区(112n)中的电子以及p-FET(92)的沟道区(112p)中的空穴的载流子迁移率增加,并且功能性n-fets(91)和p-fets(92)都改善了。

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