Light emitting diode (LED) has LED flip chip that provides electrical contact between p- or n-electrode and p- or n-electrode layer, respectively, through guides

摘要

A p-electrode layer (311) and an n-electrode layer (312) are separately arranged at the two side edges (315,316) of an isolating substrate (31) and partially cover the upper side (313) and lower side of the substrate. A LED flip chip (33) with a p-electrode (331) and an n-electrode (332) is arranged on guides (321,322) on top of each electrode layer. A molding compound (34) covers the LED flip chip and the guides. The LED flip chip provides electrical contacts between the p-electrode and p-electrode layer and between the n-electrode and n-electrode layer through the guides.