首页> 外国专利> Test access point structure implementing method for printed circuit board, involves connecting test access point with conductive path and presiding point by uncovered surface of printed circuit board to sound by test sensor

Test access point structure implementing method for printed circuit board, involves connecting test access point with conductive path and presiding point by uncovered surface of printed circuit board to sound by test sensor

机译:用于印刷电路板的测试接入点结构的实现方法,包括将测试接入点与导电路径和印刷电路板的未覆盖表面的预设点连接,以通过测试传感器发出声音

摘要

The method involves determining a position along a conductor path for a test access point without displacing an optimal circuit board layout. The optimal circuit board layout is produced, where the point is conductively connected with the path, without displacing the optimal circuit board layout. The point is presided by an uncovered surface of a printed circuit board to sound by a test sensor.
机译:该方法涉及确定沿着用于测试接入点的导体路径的位置而不移动最佳电路板布局。产生了最佳电路板布局,其中点与路径导电连接,而不会移动最佳电路板布局。该点以印刷电路板的未覆盖表面为先导,以通过测试传感器发出声音。

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