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Test access point structure implementing method for printed circuit board, involves connecting test access point with conductive path and presiding point by uncovered surface of printed circuit board to sound by test sensor
Test access point structure implementing method for printed circuit board, involves connecting test access point with conductive path and presiding point by uncovered surface of printed circuit board to sound by test sensor
The method involves determining a position along a conductor path for a test access point without displacing an optimal circuit board layout. The optimal circuit board layout is produced, where the point is conductively connected with the path, without displacing the optimal circuit board layout. The point is presided by an uncovered surface of a printed circuit board to sound by a test sensor.
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