Printed circuit board i.e. multi-layer printed circuit board, testing method, involves coupling ultrasound power source into establishment insufficient layer composite overheating unit to investigate board preferred to local overheating

摘要

The method involves loading a multi-layer printed circuit board (PCB) (4), and testing a defect using power from an ultrasound power source (2). The power source is coupled into an establishment insufficient layer composite overheating unit, so that the PCB preferred to local overheating is investigated automatically. The PCB is made of epoxy resin bonded layers i.e. cross-linked epoxy resin glass fiber mats and/or flexible circuit films. Non-destructive testing of individual board is carried out before soldering and/or assembling the board in a production batch. An independent claim is also included for a device for testing a PCB.