A process for the preparation of a core layer for multilayer circuit boards as well as a multilayer printed wiring board

摘要

Functional core layer (25) of a multilayer printed circuit board with resin-filled type screen holes (21), characterized in that– the core layer is composed of a plurality of semifinished products (20) of mechanically stabilizing material having a thickness of between 0,1 mm and 0,3 mm, which, by means of prepregs (9) and were fastened to one another by pressing– the core layer no strip conductors and has no electrical or electronic circuits.