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process for producing dielectric layers with low dielectric constant for beol lines with improved adhesion and low fehlerdichte
process for producing dielectric layers with low dielectric constant for beol lines with improved adhesion and low fehlerdichte
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机译:用于制备具有改进的粘附力和低费力的beol线的低介电常数介电层的方法
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摘要
A substantially defect-free, low-k dielectric film having improved adhesion is provided by (a) applying a silane coupling agent containing at least one polymerizable group to a surface of a substrate so as to provide a substantially uniform coating of said silane-coupling agent on said substrate; (b) heating the substrate containing the coating of the silane-coupling agent at a temperature of about 90° C. or above so as to provide a surface containing Si-O bonds; (c) rinsing the heated substrate with a suitable solvent that is effective in removing any residual silane-coupling agent; and (d) applying a dielectric material to the rinsed surface containing the Si-O bonds.
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