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METHOD OF MANUFACTURING DIELECTRIC INTERMEDIATE LAYERS WITH LOW DIELECTRIC CONSTANT FOR BEOL CONNECTING LINES WITH IMPROVED ADHESION AND LOW ERROR DENSITY
METHOD OF MANUFACTURING DIELECTRIC INTERMEDIATE LAYERS WITH LOW DIELECTRIC CONSTANT FOR BEOL CONNECTING LINES WITH IMPROVED ADHESION AND LOW ERROR DENSITY
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机译:具有低粘附力和低误差密度的BEOL连接线的低介电常数介电中间层的制造方法
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摘要
A substantially defect-free, low-k dielectric film having improved adhesion is provided by (a) applying a silane coupling agent containing at least one polymerizable group to a surface of a substrate so as to provide a substantially uniform coating of said silane-coupling agent on said substrate; (b) heating the substrate containing the coating of the silane-coupling agent at a temperature of about 90° C. or above so as to provide a surface containing Si-O bonds; (c) rinsing the heated substrate with a suitable solvent that is effective in removing any residual silane-coupling agent; and (d) applying a dielectric material to the rinsed surface containing the Si-O bonds.
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