Brief description of embodiments of an electronic component integrated and electrical device incorporating a component integrated thus obtained.

摘要

A process for the production of an electronic component comprises the covering of a substrate (100) by a portion (p), delimiting with the substrate a volume (v) at least partially filled with a temporary material, the removal of the temporary material by a chimney (c) for access to said volume, and the deposition of a filling material (7) in said volume from precursors brought by the chimney. The process is particularly adapted for the production of a grid of a mos type transistor. In this case, the filling material is conductive, and an electrically insulating material of the coating (8) can also be deposited in said volume before the filling material is conductive.