Front opening shipping box`s atmosphere conditioning method for use during manufacture of e.g. integrated circuit, involves supplying gas to storage chamber for conditioning duration, opening chamber door at end of duration and closing door

摘要

The method involves placing a front opening shipping box (FSOB) comprising wafers, in a storage chamber, where the box has a door that makes the atmosphere of the chamber to contact with the atmosphere in the box. The door of the chamber is closed and the chamber is supplied with the gas for a conditioning duration. The door of the chamber is opened at the end of the duration and is then immediately closed.