Power semiconductor device, has connectors on circuit pattern, on which chip and diode are mounted, of one substrate for connection with another circuit pattern of another substrate, where connection area of chip with connectors is extended

摘要

The device has conducting connectors (22) on a circuit pattern of a substrate (24) for connection with another circuit pattern of a substrate (26). A power semiconductor chip and a free-wheeling diode are mounted on the former pattern. The connectors are located between the chip and diode. Connection area of emitter cells of the chip with the connectors is extended and distance between them is reduced. The connectors are symmetrically disposed relative to an axis of the substrate (24) in a longitudinal direction and to axes of chip and diode in a direction normal to the former direction.