WIRING SUBSTRATE POSITIONING METHOD IN REFLOW SOLDERING TREATMENT, AND WIRING SUBSTRATE FOR REFLOW SOLDERING

摘要

PROBLEM TO BE SOLVED: To position a metal mask and a chuck on a wiring substrate causing no trouble without carrying out a special treatment, such as making a positioning hole have a formation of a transparent window, to the metal mask.;SOLUTION: When positioning the metal mask 3 superimposed on the wiring substrate 1 to the wiring substrate 1, in addition to a first positioning pattern 1d which is exposed from a positioning hole 3a of the metal mask 3 and is optically visible, a second positioning pattern 1e masked by the metal mask 3 is formed on the wiring substrate 1, and a cream-like solder is coated on a land 1c exposed from a solder pattern hole 3b and a first positioning pattern 1d exposed from the positioning hole 3a. Then the positioning of a chuck used to mount an electronic component 9 on the land 1c on the wiring substrate 1 is carried out by using the second positioning pattern 1e on which the cream-like solder is not covered, being masked by the metal mask 3.;COPYRIGHT: (C)2007,JPO&INPIT