首页> 外国专利> VAPOR PHASE EPITAXIAL GROWTH DEVICE AND PROCESSING METHOD USING VAPOR PHASE EPITAXIAL GROWTH DEVICE

VAPOR PHASE EPITAXIAL GROWTH DEVICE AND PROCESSING METHOD USING VAPOR PHASE EPITAXIAL GROWTH DEVICE

机译:气相相表层生长装置及使用气相相表层生长装置的加工方法

摘要

PROBLEM TO BE SOLVED: To provide a vapor phase epitaxial growth device that can restrain particles occurring in a processing space from affecting processing without involving deterioration in processing efficiency, and a processing method using the vapor phase epitaxial growth device.;SOLUTION: The vapor phase epitaxial growth device is provided with a susceptor 3 including a placing face onto which a substrate 2 to be processed is placed and a reaction tube 32 which forms an inner space 6 for storing the substrate 2 to be processed so as to allow a gas flow to be formed in the inner space 6. The reaction tube 32 includes rotary plates 34, 35 having surfaces 34a, 35a facing the inner space 6. The rotary plates 34, 35 are operated so that the surfaces 34a, 35a are switched between a place, which is at least on the further downstream side of the gas flow than the substrate 2 to be processed and located near the susceptor 3, and the other places.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种气相外延生长装置,该气相外延生长装置能够抑制在处理空间中发生的粒子不影响加工而不会影响加工效率,并且提供使用该气相外延生长装置的加工方法。外延生长装置设置有基座3,该基座3包括:放置面,在该放置面上放置有待处理的基板2;以及反应管32,该反应管32形成用于存储待处理的基板2的内部空间6,以使气体能够流入反应管32包括旋转板34、35,旋转板34、35具有面对内部空间6的表面34a,35a。旋转板34、35被操作以使得表面34a,35a在一个位置之间切换。至少在气流的下游侧比要处理的基板2更靠近基座3和其他位置。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007243024A

    专利类型

  • 公开/公告日2007-09-20

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP20060065913

  • 发明设计人 TANAKA NOBUMASA;

    申请日2006-03-10

  • 分类号H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-21 21:15:33

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号