HEAD MODULE, LIQUID DELIVERING HEAD, LIQUID DELIVERING APPARATUS, AND METHOD OF MANUFACTURING HEAD MODULE

摘要

PROBLEM TO BE SOLVED: To prevent a head module from coming into contact with a liquid by sealing an exposed part of a wiring substrate by a simple constitution, and also to reduce manufacturing costs.;SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by a nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is arranged to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is prepared. An electrode (tip of a wiring pattern 3a) of the flexible wiring substrate 3 is electrically connected with the electrode 23 of the head chip 20 via an anisotropic conductive film 28. At the same time, the wiring pattern 3a of the flexible wiring substrate 3 exposed from a gap between the head chip 20 and the module frame 11 is sealed by the anisotropic conductive film 28.;COPYRIGHT: (C)2007,JPO&INPIT