HEAD MODULE, LIQUID DELIVERING HEAD, LIQUID DELIVERING APPARATUS, AND METHOD OF MANUFACTURING HEAD MODULE

摘要

PROBLEM TO BE SOLVED: To prevent unnecessary radiation and change in quality of liquid from occurring by grounding a nozzle sheet by a simple constitution.;SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by the nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is disposed to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is provided. The electrode 23 of the head chip 20 is electrically connected with a wiring pattern 3a of the flexible wiring substrate 3 via an anisotropic conductive film 28. At the same time, the nozzle sheet 25 is electrically grounded via the module frame 11 and the anisotropic conductive film 28.;COPYRIGHT: (C)2007,JPO&INPIT