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SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL DEVICE, PACKAGING STRUCTURE, METHOD FOR MANUFACTURING PROJECTION ELECTRODE, AND ELECTRONIC APPARATUS
SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL DEVICE, PACKAGING STRUCTURE, METHOD FOR MANUFACTURING PROJECTION ELECTRODE, AND ELECTRONIC APPARATUS
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机译:半导体器件,光电器件,包装结构,制造投射电极的方法和电子设备
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摘要
PROBLEM TO BE SOLVED: To realize a good and stable conductive connection status by stable formation of the ideal microscopic concavo-convex shape of a projection electrode.;SOLUTION: The main feature of the semiconductor device 10 is that it is equipped with a projection electrode 10 which has a projection 11 composed of resin material formed on a substrate 1, grain 12 arranged on the projection 11, and conductive layer 13 with a concavo-convex surface formed on the foregoing projection 11 and grain 12 where the grain 12 is reflected. Since the grain 12 is arranged on the projection 11, a microscopic surface concavo-convex shape reflecting the grain 12 is formed on the surface of the conductive layer 13. Then, as the convex part of the surface concavo-convex shape breaks through the oxide film of an interconnect line at the time of mounting, the good and stable conductive connection status can be obtained.;COPYRIGHT: (C)2007,JPO&INPIT
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