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INSPECTION METHOD, INSPECTION DEVICE, EVALUATION METHOD AND EVALUATION DEVICE OF SEMICONDUCTOR SUBSTRATE

机译:半导体基板的检查方法,检查装置,评价方法及评价装置

摘要

PPROBLEM TO BE SOLVED: To provide an inspection device for a semiconductor substrate capable of detecting defects of a semiconductor substrate at high efficiency. PSOLUTION: The inspection device comprises an illumination part which radiates excitation light to a semiconductor substrate, a detector for detecting emission of photoluminescence under irradiation of the excitation light, and a data processor which processes the emission data detected by the detector to detect defects of the semiconductor substrate. It radiates the emission light until the time variation rate in intensity of the emission substantially becomes constant to detect the emission, resulting in detection of defects. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:<解决>要解决的问题:提供一种用于半导体衬底的检查装置,该检查装置能够高效地检测半导体衬底的缺陷。

解决方案:检查装置包括:照明部分,其将激发光辐射到半导体衬底;检测器,其用于检测在激发光的照射下的光致发光的发射;以及数据处理器,其处理由检测器检测到的发射数据以进行检测。半导体衬底的缺陷。它辐射发射光,直到发射强度的时间变化率基本上变为恒定以检测发射为止,从而导致缺陷的检测。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007258567A

    专利类型

  • 公开/公告日2007-10-04

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP20060083333

  • 发明设计人 TANAHASHI KATSUTO;KANEDA HIROSHI;

    申请日2006-03-24

  • 分类号H01L21/66;G01N21/64;

  • 国家 JP

  • 入库时间 2022-08-21 21:13:22

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