SOLDER RESIST INK COMPOSITION, SOLDER RESIST OBTAINED BY CURING THE COMPOSITION AND METHOD FOR PRODUCING THE SOLDER RESIST

摘要

PROBLEM TO BE SOLVED: To provide a solder resist ink composition which has no tackiness, excels in active energy ray sensitivity and can form a pattern by development with a dilute alkaline aqueous solution, after printing the ink on a substrate and evaporating the solvent, and which gives a cured film having satisfactory flexibility, high long-term insulation reliability, excellent adhesion and excellent resistance to electroless gold plating and electroless tinning when heat curing is carried out in a post curing step.;SOLUTION: The solder resist ink composition contains as essential components a specific carboxyl group-containing urethane (meth)acrylate, a carboxyl group-containing (meth)acrylate having an ester bond formed by reacting a (meth)acryloyl group-containing monocarboxylic acid with an epoxy group and containing no urethane bond, a compound having two or more epoxy groups and an organic solvent. A solder resist obtained by curing the composition and a method for producing the solder resist are also provided.;COPYRIGHT: (C)2007,JPO&INPIT