IC CARD, MANUFACTURING METHOD OF IC CARD, AND MANUFACTURING DEVICE OF IC CARD

摘要

PPROBLEM TO BE SOLVED: To provide a manufacturing method of IC card, capable of stably manufacturing an IC card of high quality while electrically connecting an antenna circuit with an IC module at a low connecting resistance value. PSOLUTION: This manufacturing method of IC card comprises steps of disposing an IC module 11 having a connecting electrode 18 within a recessed part 22 of an IC card base material 20 including an antenna circuit 34 having a connecting terminal 34a and the recessed part 22 formed so that at least part of the connecting terminal is exposed to the inside; and assigning ultrasonic vibration to the IC module disposed in the recessed part. The IC module is disposed in the recessed part so that the connecting electrode is opposed to a conductive material piece 19 provided on the connecting terminal. The antenna circuit is electrically connected with the IC module by assigning the ultrasonic vibration to the IC module. PCOPYRIGHT: (C)2007,JPO&INPIT