METHOD OF ESTIMATING CHANGE IN COPPER CONCENTRATION OF SOLDER WITH TIME LAPSE IN SOLDER TANK

摘要

PPROBLEM TO BE SOLVED: To provide a method of estimating a changing status of the copper concentration of solder with a time lapse in a solder tank on the basis of several basic data. PSOLUTION: A relationship between the copper concentration of solder and the melting rate of copper in a lead of an electronic part and an exposed electrode of a circuit board, or a relationship between the removal time interval of dross and the quantity of produced dross is acquired beforehand, and these relationships are used to estimate and calculate a change in the copper concentration of solder with a time lapse in the solder tank. PCOPYRIGHT: (C)2007,JPO&INPIT