首页> 外国专利> Piling up to the dielectric film and this dielectric film which were formed in the anode wire and the surface is adhered to one end aspect in the anode

Piling up to the dielectric film and this dielectric film which were formed in the anode wire and the surface is adhered to one end aspect in the anode

机译:堆积在阳极导线上形成的电介质膜和该电介质膜上,并在阳极的一个侧面粘接表面。

摘要

PPROBLEM TO BE SOLVED: To provide a capacitor element capable of eliminating drawbacks without causing reduction in its capacitance, and further provide its manufacturing method and a solid electrolytic capacitor using the capacitor element. PSOLUTION: Chamfered surfaces 12g, 12h or rounded corner surfaces 12g', 12h' are formed at least at two corner sides parallel to each other among four corner sides where four side surfaces 12c, 12d, 12e, 12f, and one end surface 12a and opposite other end surface 12b are intersect in a positive electrode chip 12. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:提供一种能够消除缺点而不导致其电容减小的电容器元件,并且进一步提供其制造方法和使用该电容器元件的固体电解电容器。

解决方案:倒角表面12g,12h或倒圆角表面12g',12h'至少形成在四个侧面12c,12d,12e,12f和一个端部彼此平行的两个角落中。表面12a和相对的另一端面12b在正极芯片12中相交。

版权所有:(C)2004,JPO

著录项

  • 公开/公告号JP3980434B2

    专利类型

  • 公开/公告日2007-09-26

    原文格式PDF

  • 申请/专利权人 ローム株式会社;

    申请/专利号JP20020214944

  • 发明设计人 前田 尚宏;

    申请日2002-07-24

  • 分类号H01G9/052;H01G9;

  • 国家 JP

  • 入库时间 2022-08-21 21:11:10

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