首页> 外国专利> ANISOTROPICALLY CONDUCTIVE CONNECTOR FOR WAFER INSPECTION, ITS MANUFACTURING METHOD, PROBE CARD FOR WAFER INSPECTION, AND WAFER INSPECTION DEVICE

ANISOTROPICALLY CONDUCTIVE CONNECTOR FOR WAFER INSPECTION, ITS MANUFACTURING METHOD, PROBE CARD FOR WAFER INSPECTION, AND WAFER INSPECTION DEVICE

机译:用于晶片检查的各向异性导电连接器,其制造方法,用于晶片检查的探针卡以及晶片检查装置

摘要

PROBLEM TO BE SOLVED: To provide an anisotropically conductive connector for surely achieving a satisfactory state of electrical connection to a wafer even if the pitch is extremely small between electrodes under inspection on the wafer which is an inspecting object with its contact members kept from being soon uncoupled, and to provide its manufacturing method, a probe card, and a wafer inspection device.;SOLUTION: This anisotropically conductive connector is obtained by: forming a material layer for a conductive elastomer containing conductive particles showing magnetism on a frame plate disposed on a support body; disposing a plurality of metallic masks showing magnetism on its surface, then thereto applying a magnetic field in a thickness direction while performing its hardening treatment thereby forming a conductive elastomer layer; laser-machining this to form a plurality of conductive parts for connection; piling up first and second intermediates, the first intermediate being obtained by forming a material layer for an insulation part between the conductive parts while the second intermediate being obtained by forming the plurality of contact members on a metal film to form material layer for an insulation part between them; and hardening-treating these material layers for insulation parts.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种各向异性导电连接器,即使在作为检查对象的被检查晶片上的被检查电极之间的间距非常小,并且确保其接触构件不会很快脱落,该连接器也可以确保实现与晶片的电连接的令人满意的状态。解决方案:这种各向异性导电连接器是通过以下方式获得的:在包含有磁性的导电弹性体的材料层上形成一层导电的弹性体材料层,该导电层包含显示磁性的磁性颗粒支撑体在其表面上布置多个显示磁性的金属掩模,然后在对其进行硬化处理的同时在厚度方向上施加磁场,从而形成导电弹性体层;对其进行激光加工以形成多个用于连接的导电部分;堆积第一和第二中间体,通过在导电部分之间形成用于绝缘部分的材料层获得第一中间体,而通过在金属膜上形成多个接触构件以形成用于绝缘部分的材料层获得第二中间体。它们之间; ;以及对绝缘零件的这些材料层进行硬化处理。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007085833A

    专利类型

  • 公开/公告日2007-04-05

    原文格式PDF

  • 申请/专利权人 JSR CORP;

    申请/专利号JP20050273760

  • 发明设计人 HARA FUJIO;KIMURA KIYOSHI;SHIMODA SUGIRO;

    申请日2005-09-21

  • 分类号G01R1/06;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:42

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号