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EXPOSURE SYSTEM, EXPOSURE METHOD, AND DEVICE MANUFACTURING FACTORY

机译:曝光系统,曝光方法和设备制造工厂

摘要

PROBLEM TO BE SOLVED: To lessen a burden related to control of information about a substrate.;SOLUTION: A wafer measuring instrument 400 measures information about a wafer W and writes that information, as prior measurement information, in an IC tag fixed to the wafer W through a writer/reader RW1 by radio communication, and reads in the prior measurement information from the IC tag fixed to the wafer W through a writer/reader RW2 after the wafer W is carried in an aligner 200. The aligner 200 performs processing related to exposure based on the prior measurement information thus read in.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:减轻与控制关于基板的信息有关的负担;解决方案:晶片测量仪器400测量关于晶片W的信息,并将该信息作为先前的测量信息写入固定在晶片上的IC标签中。 W通过无线电通信通过写入器/读取器RW1,并且在将晶片W载入对准器200中之后,通过写入器/读取器RW2从固定在晶片W上的IC标签中读取先前的测量信息。对准器200执行相关的处理。根据先前的测量信息进行曝光;版权:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007115784A

    专利类型

  • 公开/公告日2007-05-10

    原文格式PDF

  • 申请/专利权人 NIKON CORP;

    申请/专利号JP20050303577

  • 发明设计人 OKITA SHINICHI;

    申请日2005-10-18

  • 分类号H01L21/027;G03F7/20;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:21

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