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In the simulation device of the plasma etching device which is jointed by the plasma etching device which treats the plasma
In the simulation device of the plasma etching device which is jointed by the plasma etching device which treats the plasma
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机译:在等离子体蚀刻装置的模拟装置中,该模拟蚀刻装置与处理等离子体的等离子体蚀刻装置接合在一起
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摘要
PROBLEM TO BE SOLVED: To provide a simulation device of a semiconductor manufacturing apparatus which can confirm a series of normal operations of the semiconductor manufacturing apparatus without performing the actual operation thereof, and also to provide a semiconductor manufacturing apparatus comprising the same simulation device.;SOLUTION: A plasma treatment apparatus 11 is provided with a control device (APC server) 41, and the control device 41 is connected to an input/output device 51. The control device 41 instructs, when the plasma treatment apparatus 11 performs the actual device manufacturing process, the plasma treatment apparatus 11 to perform the predetermined etching process based on data detected by electric measuring devices 17, 20, gas flow rate sensors 27, 29, a temperature sensor 13b, a pressure sensor 12a, and a plasma emission spectroscope 31. Meanwhile, the control device 41 performs the operation simulation of the plasma treatment apparatus 11 when the apparatus does not perform the device manufacturing process.;COPYRIGHT: (C)2004,JPO
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