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In the simulation device of the plasma etching device which is jointed by the plasma etching device which treats the plasma

机译:在等离子体蚀刻装置的模拟装置中,该模拟蚀刻装置与处理等离子体的等离子体蚀刻装置接合在一起

摘要

PROBLEM TO BE SOLVED: To provide a simulation device of a semiconductor manufacturing apparatus which can confirm a series of normal operations of the semiconductor manufacturing apparatus without performing the actual operation thereof, and also to provide a semiconductor manufacturing apparatus comprising the same simulation device.;SOLUTION: A plasma treatment apparatus 11 is provided with a control device (APC server) 41, and the control device 41 is connected to an input/output device 51. The control device 41 instructs, when the plasma treatment apparatus 11 performs the actual device manufacturing process, the plasma treatment apparatus 11 to perform the predetermined etching process based on data detected by electric measuring devices 17, 20, gas flow rate sensors 27, 29, a temperature sensor 13b, a pressure sensor 12a, and a plasma emission spectroscope 31. Meanwhile, the control device 41 performs the operation simulation of the plasma treatment apparatus 11 when the apparatus does not perform the device manufacturing process.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种半导体制造设备的仿真设备,该仿真设备可以在不执行其实际操作的情况下确认该半导体制造设备的一系列正常操作,并且还提供一种包括该仿真设备的半导体制造设备。解决方案:等离子处理设备11配备有控制设备(APC服务器)41,并且控制设备41连接到输入/输出设备51。控制设备41指示等离子处理设备11执行实际设备时制造过程中,等离子体处理设备11根据电测量设备17、20,气体流速传感器27、29,温度传感器13b,压力传感器12a和等离子体发射光谱仪31检测到的数据执行预定的蚀刻过程。同时,控制装置41在装置进行等离子体处理时进行等离子体处理装置11的动作模拟。 s不执行设备制造过程。;版权所有:(C)2004,日本特许厅

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