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High frequency electronic components using low dielectric loss tangent insulation materials
High frequency electronic components using low dielectric loss tangent insulation materials
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机译:使用低介电损耗正切绝缘材料的高频电子元件
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摘要
An electronic device for high frequency signals having a small dielectric loss and a high efficiency is provided, in which a low dielectric loss tangent resin composition is used, for coping with high frequency signals, as an insulating layer. The electronic device is fabricated using an insulating layer containing a crosslinked structure of a crosslinking ingredient represented by the following general formula (I): (where R represents a hydrocarbon skeleton, RSUB1/SUB, which may be identical or different from each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, RSUB2/SUB, RSUB3 /SUBand RSUB4/SUB, which may be identical or different from each other, each represents a hydrogen atom or a hydrocarbon group of 1 to 6 carbon atoms, m is an integer of 1 to 4 and n is an integer of 2 or greater).
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