首页> 外国专利> Etching treatment manner null of the etching central processing unit of the film carrier tape for electronic parts implementation and the film carrier tape for electronic parts implementation

Etching treatment manner null of the etching central processing unit of the film carrier tape for electronic parts implementation and the film carrier tape for electronic parts implementation

机译:电子零件实施用薄膜载带和电子零件实施用薄膜载带的蚀刻中央处理单元的蚀刻处理方式为零

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for etching process capable of uniform etching in manufacturing a film carrier tape for mounting electronic components, wherein the film carrier tape for mounting electronic components can be transferred in an etching apparatus at a constant speed, the film carrier tape can be left undone in the etching apparatus for a constant time, and the etching procedure can be carried out at a constant pace. ;SOLUTION: The method and the apparatus for film carrier tape for mounting the electronic components is performed for etching continuously fed film carrier tape. The etching process is carried out by travelling the film carrier tape while lubricating liquid is blown out onto the travelling side of an etching plate.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种蚀刻工艺的方法和装置,其能够在制造用于安装电子部件的膜载带中进行均匀蚀刻,其中,用于安装电子部件的膜载带可以在蚀刻装置中以恒定速度传送。因此,可以将膜载带在蚀刻装置中静置一定时间,并且可以恒定速度进行蚀刻。 ;解决方案:执行用于安装电子元件的薄膜载带的方法和设备,以蚀刻连续送入的薄膜载带。蚀刻过程是通过在润滑液吹到蚀刻板的移动侧的同时使膜载带移动来进行的;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP3987668B2

    专利类型

  • 公开/公告日2007-10-10

    原文格式PDF

  • 申请/专利权人 三井金属鉱業株式会社;

    申请/专利号JP19990370461

  • 发明设计人 黒 川 俊 彦;因 幡 直 文;

    申请日1999-12-27

  • 分类号H01L21/60;B05D3/10;B05D7/04;

  • 国家 JP

  • 入库时间 2022-08-21 21:09:43

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