The solvent improvement resin type which includes the filler which possesses high Tg, transparency and satisfactory reliability in the applied example of under filling of wafer level

摘要

A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.