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III family nitride electronic device structure which possesses the high Al content AlGaN spread barrier

机译:具有高Al含量AlGaN扩散势垒的III族氮化物电子器件结构

摘要

In order that movement of the dopant to inside the active region is controlled from the dope conversion material, the particular barrier material includes high Al content Al XGa yN the dope conversion material which is constituted, in the active region, and III family nitride electronic device structure which includes the barrier material, here, it is x+y=1 and x0.50. In the feature of specification, thickness approximately as portable of 5 - approximately 200 angstroms/spread barrier layer using AlN, for example the magnesium to inside the active region of III family nitride electronic device such as UV-LED photoelectron element and/or influx of the silicon dopant material is controlled.
机译:为了从掺杂转换材料控制掺杂剂向有源区域内部的移动,特定的阻挡材料在有源区域中包括高Al含量的Al XGa yN 掺杂转换材料,该Al构成,并且,包括阻挡材料的III族氮化物电子器件结构在这里是x + y = 1和x0.50。在规范的特征中,厚度大约是使用AlN(例如,镁)的5-大约200埃/扩展阻挡层的可移植厚度,例如,镁到III族氮化物电子器件(例如UV-LED光电子元件)的有源区域内部和/或控制硅掺杂剂材料。

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