首页> 外国专利> DIP MOLDING LATEX, PROCESS FOR PRODUCING THE SAME, DIP MOLDING COMPOSITION AND DIP MOLDED PRODUCT

DIP MOLDING LATEX, PROCESS FOR PRODUCING THE SAME, DIP MOLDING COMPOSITION AND DIP MOLDED PRODUCT

机译:浸塑成型胶,相同的生产工艺,浸塑组合物和浸塑产品

摘要

PPROBLEM TO BE SOLVED: To provide a dip molded product excellent in a touch feeling and having excellent tensile strength, to provide a dip molding composition capable of giving the dip molded product, to provide a dip molding latex capable of being used for the dip molding composition, and to provide a method for producing the latex. PSOLUTION: This dip molding latex comprises the latex of a copolymer which is given by copolymerizing 100 pts.wt. of a monomer mixture comprising 65-84.5 pts.wt. of a conjugated diene monomer, 15-25 pts.wt. of an ethylenic unsaturated nitrile monomer, 0.5-10 pts.wt. of an ethylenic unsaturated acid monomer, and 0-19.5 pts.wt. of the other ethylenic unsaturated monomer capable of copolymerizing with the monomers, wherein the copolymer has a first glass transition temperature (Tg1) and a second glass transition temperature (Tg2), so that a difference between Tg1 and Tg2 is not more than 20C. PCOPYRIGHT: (C)2003,JPO
机译:

要解决的问题:提供一种触感优异并且具有优异的拉伸强度的浸渍模塑产品,提供一种能够提供该浸渍模塑产品的浸渍模塑组合物,提供一种能够用于以下用途的浸渍模塑胶乳。本发明提供了一种浸渍模塑组合物,并提供了一种生产胶乳的方法。

解决方案:该浸渍模塑胶乳包含共聚物的胶乳,该共聚物的胶乳通过共聚100 pts.wt给出。包含65-84.5 pts.wt的单体混合物。共轭二烯单体的含量为15-25 pts.wt.烯键式不饱和腈单体的用量为0.5-10 pts.wt.烯键式不饱和酸单体的含量为0-19.5pts.wt。可与单体共聚的另一种烯键式不饱和单体,其中共聚物具有第一玻璃化转变温度(Tg1)和第二玻璃化转变温度(Tg2),因此Tg1和Tg2之间的差不大于20℃。

版权:(C)2003,日本特许厅

著录项

  • 公开/公告号JP3915489B2

    专利类型

  • 公开/公告日2007-05-16

    原文格式PDF

  • 申请/专利权人 日本ゼオン株式会社;

    申请/专利号JP20010363419

  • 发明设计人 太田 久紀;外山 淳;児玉 和美;

    申请日2001-11-28

  • 分类号C08F236/12;C08F2;C08J5/02;C08L9/02;

  • 国家 JP

  • 入库时间 2022-08-21 21:09:27

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