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The copper foil surface analysis device, and copper foil surface analysis mannered

机译:铜箔表面分析装置及铜箔表面分析方法

摘要

PROBLEM TO BE SOLVED: To detect, with high accuracy, adhesion of fiber onto a resin coating and a defect due to tar or a bubble on a copper foil surface coated with the resin.;SOLUTION: Light is irradiated on the surface of copper foil wound around a guide roller 26, regularly reflected light from the copper foil surface and scattered light from the copper foil surface are received by a CCD camera 14a and a CCD camera 14b, respectively. When luminous energy received by the CCD camera 14a is less than a first threshold value, and the shape of that region is elongated, it is determined that fiber adheres. Luminous energy received by the CCD camera 14b is less than a second threshold value, it is determined that tar adheres. When the luminous energy received by the CCD camera 14b is more than a third threshold value larger than the second threshold value, it is determined that a bubble is present in the region.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:高精度检测纤维在树脂涂层上的附着力以及涂有树脂的铜箔表面上的焦油或气泡引起的缺陷;解决方案:光照射到铜箔的表面卷绕在导辊26上的来自铜箔表面的规则反射光和来自铜箔表面的散射光分别被CCD照相机14a和CCD照相机14b接收。当由CCD照相机14a接收的光能小于第一阈值并且该区域的形状被拉长时,确定纤维粘附。 CCD相机14b接收的光能小于第二阈值,确定焦油粘附。当CCD摄像机14b接收的光能大于第二阈值的第三阈值以上时,确定该区域中存在气泡。;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP3909457B2

    专利类型

  • 公开/公告日2007-04-25

    原文格式PDF

  • 申请/专利权人 国際技術開発株式会社;

    申请/专利号JP20020023379

  • 发明设计人 周 慶衛;藤原 順;

    申请日2002-01-31

  • 分类号G01N21/956;G01N21/892;G01B11/30;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 21:08:10

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