首页>
外国专利>
The copper foil surface analysis device, and copper foil surface analysis mannered
The copper foil surface analysis device, and copper foil surface analysis mannered
展开▼
机译:铜箔表面分析装置及铜箔表面分析方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To detect, with high accuracy, adhesion of fiber onto a resin coating and a defect due to tar or a bubble on a copper foil surface coated with the resin.;SOLUTION: Light is irradiated on the surface of copper foil wound around a guide roller 26, regularly reflected light from the copper foil surface and scattered light from the copper foil surface are received by a CCD camera 14a and a CCD camera 14b, respectively. When luminous energy received by the CCD camera 14a is less than a first threshold value, and the shape of that region is elongated, it is determined that fiber adheres. Luminous energy received by the CCD camera 14b is less than a second threshold value, it is determined that tar adheres. When the luminous energy received by the CCD camera 14b is more than a third threshold value larger than the second threshold value, it is determined that a bubble is present in the region.;COPYRIGHT: (C)2003,JPO
展开▼