Following to the inside and outside surface discriminatory conversion mannered null lapping process of the silicon wafer which uses the etching manner and this manner of the silicon wafer which uses alkaline

摘要

PROBLEM TO BE SOLVED: To provide alkali etching liquid which can provide a large shape of a facet and can control the formation of a deep pit, a method for etching a silicon wafer to provide the excellent flatness and small roughness of the rear surface of the wafer of which the front surface is polished as a mirror surface, and also provide a method for discriminating the front and rear surfaces of the silicon wafer which enables the visual recognition of the front and rear surfaces of the wafer having high precision flatness and small surface roughness.;SOLUTION: The alkali etching liquid can be obtained by mixing lithium ions into a alkali aqueous solution which is mainly composed of sodium hydroxide or potassium hydroxide.;COPYRIGHT: (C)2003,JPO