BONDING STRUCTURE OF PATTERN ELECTRODES USING ULTRA-VIOLET RAYS AND METHOD FOR BONDING PATTERN ELECTRODES USING THE SAME

摘要

The present invention relates to a bonding structure of pattern electrodes using ultra-violet rays and a method for bonding pattern electrodes using the same. A bonding structure of pattern electrodes using ultra-violet rays according to the present invention comprises a front or back glass panel; a plurality of front or back pattern electrodes formed on the front or back glass panel; a tape automatic bonding (TAB); a plurality of pattern electrodes formed on the TAB; and a UV curing layer coated either on the plurality of front or back pattern electrodes or on the plurality of pattern electrodes formed on the TAB, wherein a is bonding between the plurality of front or back pattern electrodes and the plurality of pattern electrodes formed on the TAB is made in a way that the UV curing layer is cured at a normal temperature by UV emitted from a UV emission device, under a condition that the plurality of front or back pattern electrodes and the plurality of pattern electrodes formed on the TAB are aligned with each other and a certain pressure is applied thereon by a certain pressure device.