BONDING STRUCTURE OF PATTERN ELECTRODES USING ULTRA-VIOLET RAYS AND BONDING METHOD FOR MANUFACTURING THE SAME

摘要

A bonding structure of pattern electrodes using ultraviolet rays and a bonding method thereof are provided to prevent a positioning error due to a difference of thermal expansion by using a room temperature compression method. A bonding structure includes a front or rear glass substrate(210), plural front or rear pattern electrodes(220) formed on the front or rear glass substrate, a tap(240), plural pattern electrodes(250) formed on the tap, and a ultraviolet curing agent layer applied on the front or rear pattern electrode or the pattern electrode formed on the tap. The front or rear pattern electrode is bonded to the pattern electrode formed on the tap by applying ultraviolet rays onto the ultraviolet curing agent layer, while a certain pressure is applied to the pattern electrodes.