METHOD OF MONITORING DEPOSITION TEMPERATURE OF A COPPER SEED LAYER AND METHOD OF FORMING A COPPER LAYER

摘要

A method for monitoring a deposition temperature of a Cu seed layer by measuring an optical reflectivity of the Cu seed layer deposited on a substrate; and estimating the deposition temperature of the Cu seed layer by comparing the measured optical reflectivity with a reference optical reflectivity of a reference Cu seed layer in which an agglomeration phenomenon has not happened. The estimating step includes computing the deposition temperature of the Cu seed layer at a temperature higher than about −25° C. which is a reference deposition temperature for depositing the reference Cu seed layer if the measured reflectivity is smaller than the reference optical reflectivity.