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PROCESS FOR PRODUCING A FREE-STANDING III-N LAYER, AND FREE-STANDING III-N SUBSTRATE

机译:生产自立型III-N层和自立型III-N基质的过程

摘要

A process for producing a free-standing III-N layer, where III denotes at least one element from group III of the periodic system, selected from Al, Ga and In, comprises depositing on a Li(Al,Ga)Ox substrate, where x is in a range between 1 and 3 inclusive, at least one first III-N layer by means of molecular beam epitaxy. A thick second III-N layer is deposited on the first III-N layer by means of a hydride vapor phase epitaxy. During cooling of the structure produced in this way, the Li(Al,Ga)Ox substrate completely or largely flakes off the III-N layers, or residues can be removed if necessary, by using etching liquid, such as aqua regia. A free-standing III-N substrate being substantially free of uncontrolled impurities and having advantageous properties is provided.
机译:一种用于制造独立的III-N层的方法,其中III表示选自Al,Ga和In的选自周期系统III族的至少一种元素,该方法包括沉积在Li(Al,Ga)Ox衬底上,其中通过分子束外延,x在1至3之间的范围内,包括至少一个第一III-N层。借助于氢化物气相外延在第一III-N层上沉积厚的第二III-N层。在以这种方式产生的结构的冷却过程中,Li(Al,Ga)Ox基板完全或大部分从III-N层剥落,或者必要时可以通过使用蚀刻液(例如王水)去除残留物。提供了一种独立的III-N衬底,该衬底基本上不含不受控制的杂质并且具有有利的特性。

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