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Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly
Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly
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机译:倒装芯片封装的制造方法,制造基板和倒装芯片组装
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摘要
A method for manufacturing a flip-chip package, in particular to a method for filling the space between an active side of a chip and a contact side of a substrate is disclosed. Furthermore, a substrate for supporting the filling and a flip-chip assembly is disclosed. The substrate includes a feed opening extending from the chip mounting surface within the chip supporting area to the substrate mounting surface. Via this feed opening, the underfill material is filled into the intervening space between substrate and chip.
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