首页> 外国专利> Evaluation method of semiconductor device, manufacturing method of the semiconductor device, design management system of device comprising the semiconductor device, dose amount control program for the semiconductor device, computer-readable recording medium recording the program, and dose amount control apparatus

Evaluation method of semiconductor device, manufacturing method of the semiconductor device, design management system of device comprising the semiconductor device, dose amount control program for the semiconductor device, computer-readable recording medium recording the program, and dose amount control apparatus

机译:半导体装置的评估方法,半导体装置的制造方法,包括该半导体装置的装置的设计管理系统,该半导体装置的剂量控制程序,记录该程序的计算机可读记录介质以及剂量控制装置

摘要

There is provided a new method of obtaining the dopant activation rate of a device accurately and simply in a different way from a method of obtaining a carrier density with use of a Hall measurement or CV measurement, and also provided a production method of a device performed with a proper threshold voltage control, that is, a dose amount control, according to the obtained activation rate. The inventor devised a method in which the activated dopant density (first dopant density) in a semiconductor film is obtained from the threshold voltage and the flat band voltage of a device, then the dopant activation rate is obtained from the ratio of the obtained activated dopant density to the added dopant density (second dopant density) obtained by SIMS analysis. The invention allows easily obtaining the dopant activation rate in the channel region and the impurity region of the device.
机译:提供了一种与使用霍尔测量或CV测量获得载流子密度的方法不同的,准确而又简单地获得器件的掺杂剂活化率的新方法,并且还提供了一种进行器件制造的方法根据获得的激活率,用适当的阈值电压控制,即剂量控制。发明人设计了一种方法,其中从器件的阈值电压和平坦带电压获得半导体膜中的活化掺杂剂密度(第一掺杂剂密度),然后从所获得的活化掺杂剂的比率获得掺杂剂活化率。密度增加到通过SIMS分析获得的添加掺杂剂密度(第二掺杂剂密度)。本发明允许容易地获得器件的沟道区和杂质区中的掺杂剂活化率。

著录项

  • 公开/公告号US2007037330A1

    专利类型

  • 公开/公告日2007-02-15

    原文格式PDF

  • 申请/专利权人 TATSUYA HONDA;

    申请/专利号US20060503205

  • 发明设计人 TATSUYA HONDA;

    申请日2006-08-14

  • 分类号H01L21/84;

  • 国家 US

  • 入库时间 2022-08-21 21:05:15

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