A micro-electromechancial system has a moveable element supported by a flexure, the flexure being formed of a substitutionally alloyed intermetallic compound. The substitutionally alloyed intermetallic compound includes a base intermetallic compound having a major component and a minor component; and at least one of a first substituent and a second substituent. The first and second substituents are substituted coherently for the major and minor components of the base intermetallic compound, respectively, in amounts sufficient to reduce creep in the resulting substitutionally alloyed intermetallic compound without substantially modifying the crystalline structure of the base intermetallic compound.
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