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Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
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机译:用于在微特征工件的处理过程中(包括在浸没式光刻过程中)控制环境压力的系统和方法
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摘要
Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography, are disclosed. A system in accordance with one embodiment includes a support configured to carry a microfeature workpiece with a surface of the microfeature workpiece at a support location, and a liquid supply device positioned proximate to the support to dispense liquid at the surface location. The system can further include a generally gas-tight enclosure disposed around at least a portion of the surface location. The enclosure can be coupleable to a vacuum source and can be configured to withstand an internal pressure less than atmospheric pressure. This arrangement can be used in the context of an immersion photolithography system, or other systems for which a liquid is disposed on the surface of the microfeature workpiece.
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