首页> 外国专利> Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography

Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography

机译:用于在微特征工件的处理过程中(包括在浸没式光刻过程中)控制环境压力的系统和方法

摘要

Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography, are disclosed. A system in accordance with one embodiment includes a support configured to carry a microfeature workpiece with a surface of the microfeature workpiece at a support location, and a liquid supply device positioned proximate to the support to dispense liquid at the surface location. The system can further include a generally gas-tight enclosure disposed around at least a portion of the surface location. The enclosure can be coupleable to a vacuum source and can be configured to withstand an internal pressure less than atmospheric pressure. This arrangement can be used in the context of an immersion photolithography system, or other systems for which a liquid is disposed on the surface of the microfeature workpiece.
机译:公开了用于在微特征工件的处理期间,包括在浸没式光刻期间控制环境压力的系统和方法。根据一个实施例的系统包括:支撑件,其被配置为携带微特征工件,并且该微特征工件的表面在支撑位置处;以及液体供应装置,该液体供应装置位于该支撑件附近以在该表面位置处分配液体。该系统可以进一步包括围绕表面位置的至少一部分设置的大致气密的外壳。外壳可以与真空源连接,并且可以配置为承受小于大气压的内部压力。这种布置可以在浸没式光刻系统或将液体设置在微特征工件的表面上的其他系统的背景下使用。

著录项

  • 公开/公告号US7456928B2

    专利类型

  • 公开/公告日2008-11-25

    原文格式PDF

  • 申请/专利权人 KUNAL R. PAREKH;

    申请/专利号US20050214388

  • 发明设计人 KUNAL R. PAREKH;

    申请日2005-08-29

  • 分类号G03B27/42;

  • 国家 US

  • 入库时间 2022-08-21 19:29:10

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