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Pulsed deposition layer gap fill with expansion material
Pulsed deposition layer gap fill with expansion material
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机译:脉冲沉积层间隙填充膨胀材料
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摘要
Conformal dielectric deposition processes supplemented with a deposited expansion material can fill high aspect ratio narrow width gaps with significantly reduced incidence of voids or weak spots. The technique can also be used generally to form composites, such as for the densification of any substrate having open spaces or gaps to be filled without the incidence of voids or seams.
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