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Self-aligned split-gate NAND flash memory and fabrication process

机译:自对准分裂栅NAND闪存及其制造工艺

摘要

Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates. The memory cells are substantially smaller than prior art cells, and the array is biased so that all of the memory cells in it can be erased simultaneously, while programming is bit selectable.
机译:自对准分裂栅NAND闪存单元阵列和制造过程,其中在衬底的有源区域中的位线扩散和公共源扩散之间形成多行自对准分裂栅单元。每个单元具有相互堆叠并自对准的控制栅和浮动栅,以及与堆叠栅分开并与对准栅的擦除和选择栅,每行两端的选择栅与该位部分重叠排列源扩散。擦除栅下方的沟道区被重掺杂,以减小位线和源极扩散之间的沟道电阻,并且浮栅被其他栅围绕,其方式提供了显着增强的高压耦合至浮栅的能力。其他的大门。该存储单元比现有技术的单元小得多,并且该阵列被偏置以使得其中的所有存储单元可以被同时擦除,而编程是位可选择的。

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