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Method and apparatus for low temperature copper to copper bonding
Method and apparatus for low temperature copper to copper bonding
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机译:低温铜与铜结合的方法和设备
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摘要
A method comprising: coating a conductive bump on a first substrate with a conductive material to form a coated conductive bump; coating a conductive bump on a second substrate with a conductive material to form a coated conductive bump; and bonding the coated conductive bump on the first substrate to the coated conductive bump on the second substrate to electrically connect the first substrate to the second substrate.
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