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High-density metal capacitor using dual-damascene copper interconnect
High-density metal capacitor using dual-damascene copper interconnect
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机译:使用双镶嵌铜互连的高密度金属电容器
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摘要
An electronic structure having a first conductive layer provided by a dual damascene fabrication process; an etch-stop layer provided by the fabrication process, and electrically coupled with the first conductive layer, the etch-stop layer having a preselected dielectric constant and a predetermined geometry; and a second conductive layer, electrically coupled with the etch-stop layer. The structure can be, for example, a metal-insulator-metal capacitor, an antifuse, and the like.
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